PCB With Black And White Soldermask

1.Base Material

FR-1/FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC FPC

2.Layers

1-28

3.Finised inner/outer copper thickness

1-6OZ

4.Finished board thickness

0.2-7.0mm

Tolerance

Board thickness≤1.0mm: +/-0.1mm

1<Board thickness≤2.0mm: +/-10%

Board thickness>2.0mm: +/-8%

5.Max panel size

≤2sidesPCB: 600*1500mm

Multilayer PCB: 500*1200mm

6.Min conductor line width/spacing

Inner layers: ≥3/3mil

Outer layers: ≥3.5/3.5mil

7.Min hole size

Mechanical hole: 0.15mm

Laser hole: 0.1mm

Drilling precision: first drilling

First drilling: 1mil

Second drilling: 4mil

8.Warpage

Board thickness≤0.79mm: β≤1.0%

0.80≤Board thickness≤2.4mm: β≤0.7%

Board thickness≥2.5mm: β≤0.5%

9.Controlled Impedance

+/-5%

10. Aspect Ratio

15:1

11.Min welding ring

4mil

12.Min solder mask bridge

≥0.08mm

13.Plugging vias capability

0.2-0.8mm

14. Hole tolerance

PTH: +/-3mil

NPTH: +/-2mil

15.Outline profile

Rout/ V-cut/ Bridge/ Stamp hole

16.Surface treatment

OSP: 0.5-0.5um

HASL: 2-40um

Lead free HASL: 2-40um

ENIG: Au 1-10U’’

ENEPIG: PB 2-5U’’/ Au 1-8U’’

Immersion Tin:0.8-1.2um

Immersion silver: 0.1-1.2um

Peelable blue mask

Carbon ink

Gold plating: Au 1-150U’’

17.Solder mask

Green,Black,White,Blue,Red,Yellow,etc.

18.Silkscreen

Black,White,Blue,Red,Yellow,etc.

19. E-testing pass percent

97% pass for the first time,+/-2%(tolerance)

FQC-Physical Lab: Reliability tests

20.Certificate

UL,SGS,ROHS,ISO/TS16949,ISO14001:2004

Passive Down to 0201 size

BGA and VFBGA

Leadless Chip Carriers/CSP

Double-sided SMT Assembly

Fine Pitch to 0.8mils

BGA Repair and Reball

Part Removal and Replacement

Smallest:0.25*0.25 inches

Largest:20*20 inches

Bill of Materials

Gerber files

Pick-N-Place file