Outer layer Cu:1oz Inner layer Cu:1oz Min track/gap 2.3mil/3mil Min hole: 0.15mm Board thickness: 1.2mm Surface : ENIG Material：FR4 IT-180A Tg:180 Specialty: 5-Steps HDI,Impedance Control Laser Blind Hole:1-2,2-3,3-4,4-5,5-6,7-8,8-9,9-10,10-11,11-12.
PCB with isola Panasonic base material 1.2mm thickness FR4 TG170 4/4mil line width/space ENIG（1U”） 2oz finished 100% AOI Test ISO.9001/CQC/ISO.TS16949/ROHS Application：Consumer/home/network
Mixed FR4+AL PCB 2.0mm thickness FR4+AL TG150 4/4mil line width/space ENIG（1U”） 2oz finished 100% AOI Test ISO.9001/CQC/ISO.TS16949/ROHS Application：Consumer/home/network
HDI Stack up with 3 step 1.6mm thickness FR4 TG170 4/4mil line width/space ENIG（1U”） 2oz finished 100% AOI Test ISO.9001/CQC/ISO.TS16949/ROHS Application：Consumer/home/network
4 Step HDI PCB 1.6mm thickness FR4 TG150 4/4mil line width/space ENIG（1U”） 2oz finished 100% AOI Test ISO.9001/CQC/ISO.TS16949/ROHS Application：Consumer/home/network
PCB with Black and white soldermask 1.6mm thickness FR4 TG130 4/4mil line width/space ENIG（1U”） 2oz finished 100% AOI Test ISO.9001/CQC/ISO.TS16949/ROHS Application：Consumer/home/network
