

We use high-precision laser drilling systems to process micro-vias, blind vias and buried vias on various high-end PCBs. The non-contact processing ensures smooth hole walls, accurate positioning and better reliability for every circuit board.


We use high-precision laser drilling systems to process micro-vias, blind vias and buried vias on various high-end PCBs. The non-contact processing ensures smooth hole walls, accurate positioning and better reliability for every circuit board.
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