Laser via drilling machine

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Laser Drilling Machine — Precision Micro-Via Drilling for HDI & High-Layer-Count PCBs

Product Overview

Our Laser Drilling Machine is a high-precision automatic drilling system used for micro-via formation in PCB manufacturing. It uses a high-energy UV / CO2 laser to rapidly and precisely ablate dielectric and copper layers, creating blind vias, buried vias and through micro-vias required for high-density interconnection. Replacing traditional mechanical drilling for micro holes, the equipment supports extremely small via diameters, high aspect ratio and dense via arrays, greatly improving the production capability for HDI boards and high-layer-count multilayer boards. It is the core drilling equipment for the manufacture of smartphones, servers, automotive electronics, 5G communication equipment and other high-end PCB products.

Core Advantages

Ultra-Fine Micro-Via Drilling Capability: Supports extremely small via diameters down to tens of microns, with high aspect ratio and high-density via arrangement. It reliably creates fine blind and buried vias that mechanical drilling cannot achieve, meeting the fine-line and high-density requirements of HDI boards.
High Precision & Excellent Position Accuracy: Equipped with high-precision motion system, auto focus and CCD alignment, the equipment guarantees accurate via positioning and consistent hole quality. Stable drilling depth control ensures uniformity across the whole board and between batches, reducing defect rate.
High Efficiency & Fast Throughput: Advanced laser scanning and high-speed movement enable fast and continuous drilling. Multiple laser sources and optimized drilling paths greatly improve production efficiency while reducing per-hole cost, supporting mass production.
Low Thermal Damage & High-Quality Hole Wall: Precise laser energy control minimizes thermal damage to the board, producing clean via walls with minimal residue and char. It ensures reliable subsequent metallization (plating) and improves hole reliability.
Excellent Material Compatibility: Applicable to FR4, high-frequency materials, high-Tg boards and thin cores. It handles various dielectric thicknesses and copper conditions, providing flexible drilling solutions for different board types.
Intelligent Data Recording & Traceability: The system automatically records drilling parameters, via positions and quality data, realizing full-process traceability and helping the production team optimize drilling processes and continuously improve quality stability.

Technical Parameters

Equipment Type: High-Precision UV / CO2 Laser Drilling Machine
Minimum Via Diameter: Down to tens of microns (micron-level micro-via)
Drilling Accuracy: High position accuracy with auto focus and CCD alignment
Applicable Board Thickness: Suitable for thin cores and multilayer stack-ups
Drilling Types: Blind via, buried via and through micro-via
Compatible Board Types: HDI high-density board, high-layer-count multilayer PCB, high-frequency board, high-Tg board
Working Mode: Fully automatic feeding, alignment, drilling and data recording
Data Function: Automatic parameter recording, via position traceability and full quality control

Company Equipment Strength

To build a rigorous and precise via-drilling production system, our company is equipped with a complete set of advanced laser drilling machines, forming a full-coverage micro-via drilling capability for HDI and high-layer-count board production. All drilling machines adopt industry-leading high-precision laser systems with stable operation and long-term consistent drilling performance. We support 24-hour uninterrupted batch production, which fully meets the strict micro-via quality requirements of high-end products. Through precise laser drilling of every micro-via, we effectively control via quality and improve the final finished product yield. Perfect matching with front-end imaging, etching and subsequent plating processes ensures that every batch of PCB products delivered to customers meets high-standard quality requirements, highlighting our strict quality control system and strong comprehensive production strength.

Application Scope

The laser drilling machine is widely used in the micro-via drilling of high-end HDI and multilayer PCBs. It is essential quality guarantee equipment for smartphones, 5G communication equipment, server hardware, automotive electronics, industrial control equipment, medical electronics and smart wearable product circuit boards. It provides reliable precision drilling support for high-density, high-precision and high-reliability PCB products, ensuring stable and consistent product quality for global customers.