Pattern Plating machine

Pattern Plating Machine

Pattern Plating Machine

Pattern Plating Machine — Selective Copper & Tin Plating for Circuit Formation

Product Overview

Our Pattern Plating Machine is a high-precision automatic plating system used in PCB manufacturing to selectively deposit copper and tin on exposed circuit patterns. After pattern imaging, the equipment electroplates copper and tin only onto the defined circuit areas, forming the conductive traces and providing a tin protective layer for subsequent etching. By combining precise current control, uniform solution flow and automatic additive dosing, the machine achieves highly uniform plating on fine-line patterns, ensuring accurate line width and thickness. It effectively solves the common problems of uneven plating, pattern overhang and poor etching in traditional processes, and is widely applicable to the production of HDI boards, high-layer-count multilayer boards, thick copper boards and fine-line precision boards.

Core Advantages

High-Precision Selective Plating: Precise current and rectifier control ensure copper and tin are deposited accurately only on the exposed circuit patterns, producing clean and consistent conductive traces with uniform thickness across the whole board.
Fine-Line Capability & Good Dimensional Control: The machine supports ultra-fine line plating with minimal overhang and accurate line width control, meeting the strict requirements of high-density and fine-pitch patterns.
High Efficiency & High Throughput: Fully automatic conveying and process control enable fast and stable plating. The machine supports large board sizes and high production throughput, greatly improving plating efficiency while reducing operating cost.
Stable Process & Low Defect Rate: Equipped with precise rectifiers, automatic additive analysis and closed-loop process control, the equipment maintains stable plating parameters and consistent quality between batches, reducing defects, overplating and rework.
Excellent Material Compatibility: Applicable to FR4, high-frequency materials, high-Tg boards, thick copper and thin cores, providing flexible plating solutions for various board types and production requirements.
Intelligent Data Recording & Traceability: The system automatically records plating parameters, thickness data and quality information, realizing full-process traceability and helping the production team optimize plating processes and continuously improve quality stability.

Technical Parameters

Equipment Type: Automatic Pattern Plating Machine
Plating Type: Selective copper plating and tin plating on circuit patterns
Plating Uniformity: High whole-board uniformity with closed-loop control
Fine-Line Capability: Supports ultra-fine line and fine-pitch pattern plating
Applicable Board Thickness: Suitable for thin cores, thick copper and multilayer stack-ups
Maximum Panel Size: Up to 24" × 24" (610mm × 610mm)
Compatible Board Types: HDI high-density board, high-layer-count multilayer PCB, thick copper PCB, high-frequency board, high-Tg board
Working Mode: Fully automatic feeding, plating, rinsing and drying
Data Function: Automatic parameter recording, additive analysis and full quality traceability

Company Equipment Strength

To build a rigorous and precise circuit plating production system, our company is equipped with a complete set of advanced pattern plating machines, forming a full-coverage selective plating capability for copper and tin deposition on circuit patterns. All plating machines adopt industry-leading automatic control technology with stable operation and long-term consistent plating performance. We support 24-hour uninterrupted batch production, which fully meets the strict plating quality requirements of high-end products. Through precise selective plating of every circuit pattern, we effectively control line width and thickness uniformity and improve the final finished product yield. Perfect matching with front-end imaging, etching and subsequent processes ensures that every batch of PCB products delivered to customers meets high-standard quality requirements, highlighting our strict quality control system and strong comprehensive production strength.

Application Scope

The pattern plating machine is widely used in the circuit formation and selective plating of high-end HDI and multilayer PCBs. It is essential quality guarantee equipment for smartphones, 5G communication equipment, server hardware, automotive electronics, industrial control equipment, medical electronics and smart wearable product circuit boards. It provides reliable copper and tin plating support for high-density, high-precision and high-reliability PCB products, ensuring stable and consistent product quality for global customers.