Oxide Replacement Line

Adhesion Promotion Line — Replacing Traditional Oxide Treatment for PCB Inner Layer

Product Overview

Our Adhesion Promotion Line (also known as the oxide replacement line) is a fully automatic surface treatment system used before lamination in multilayer PCB manufacturing. It replaces the traditional brown / black oxide treatment process with an advanced chemical micro-etching plus silane coupling agent treatment, which creates a uniform micro-roughened surface and a stable bonding enhancement layer on the inner layer copper foil. By adopting precise conveyor-speed control, constant-temperature chemical spraying and automatic concentration monitoring, the equipment achieves highly uniform treatment across the whole board, greatly improving the peel strength and reliability between inner layers. It effectively solves the problems of uneven oxide layer, acid residue, corrosion, and poor lamination adhesion commonly seen in traditional oxide lines, and is widely applicable to the mass production of high-layer-count multilayer boards, HDI boards, thick copper boards and high-frequency boards.

Core Advantages

Stable High Adhesion, No Traditional Oxide Layer: Replaces brown / black oxide with a micro-etched plus silane coupling treatment, producing a uniform and clean bonding surface. It delivers consistently high peel strength and stable lamination reliability, while eliminating the risk of oxide layer flaking, residue and board contamination caused by traditional oxide.
Excellent Compatibility for Fine-Line & High-Density Boards: The gentle micro-etching treatment causes minimal line undercut, making it fully suitable for fine-line, high-density HDI and ultra-thin core boards where traditional oxide treatment is difficult to apply. It maintains precise line integrity while securing the required adhesion.
High Uniformity & Good Process Control: Equipped with constant-temperature spray, uniform roller transport and automatic solution concentration control, the equipment guarantees consistent treatment across the full board surface and between batches. Low defect rate and high repeatability effectively reduce lamination delamination and blistering.
High Efficiency & Low Operating Cost: Fully automatic continuous production line with fast treatment speed, no manual brushing or oxide removal required. Lower chemical consumption, easy waste liquid treatment and reduced maintenance greatly cut production cost while keeping stable high throughput.
Clean, Safe & Environmentally Friendly: Replaces hazardous traditional oxide chemistry with a safer micro-etching plus silane process, greatly reducing waste liquid load and working environment hazards, meeting the strict environmental and safety requirements of modern PCB plants.
Intelligent Data Recording & Traceability: The system automatically records production parameters, chemical concentration and quality data, realizing full-process traceability and helping the production team optimize front-end processes and continuously improve lamination yield and quality stability.

Technical Parameters

Equipment Type: Fully Automatic Adhesion Promotion (Oxide Replacement) Line
Process Mode: Chemical micro-etching + silane coupling agent treatment
Applicable Board Thickness: 0.05mm – 6.0mm
Maximum Panel Size: Up to 24" × 24" (610mm × 610mm)
Treatment Uniformity: Whole-board uniform micro-roughening with high consistency
Compatible Board Types: Multi-layer PCB, HDI high-density board, thick copper PCB, ultra-thin core board, high-frequency PCB
Working Mode: Fully automatic feeding, treatment, rinsing and drying
Data Function: Automatic parameter recording, concentration monitoring and full quality traceability

Company Equipment Strength

To build a rigorous and stable lamination quality control system, our company is equipped with a complete set of advanced automatic adhesion promotion (oxide replacement) lines, forming a full-coverage treatment capability for front-end inner layer and lamination processes. All treatment lines adopt industry-leading automatic control systems with stable operation and long-term consistent treatment performance. We support 24-hour uninterrupted batch production, which fully replaces the instability of traditional manual oxide treatment. Through precise micro-etching and silane treatment of every inner layer before lamination, we effectively control adhesion defects and improve the final finished product yield. Perfect matching with front-end imaging, etching and lamination processes ensures that every batch of PCB products delivered to customers meets high-standard quality requirements, highlighting our strict quality control system and strong comprehensive production strength.

Application Scope

The adhesion promotion (oxide replacement) line is widely used in the lamination pre-treatment of high-end multilayer PCBs. It is essential quality guarantee equipment for automotive electronics, 5G communication equipment, server hardware, industrial control equipment, medical electronics and smart wearable product circuit boards. It provides reliable bonding and reliability support for high-density, high-precision and high-reliability PCB products, ensuring stable and consistent product quality for global customers.