Vacuum Etching Machine
Vacuum Etching Machine
Vacuum Etching Machine
PCB Vacuum Etching Machine
Product Overview
Core Advantages
Ultra-uniform Etching, Minimal Side Etching: Adopting vacuum negative pressure circulation technology, the etching solution fully contacts the board surface without blind spots. It effectively suppresses side etching phenomena, ensures straight circuit side walls and accurate line width control, and greatly improves the yield of ultra-fine circuit production.
Strong Adaptability for High-Difficulty Boards: Optimized liquid circulation and spraying structure enables stable etching processing for 0.05mm ultra-thin core boards, thick copper boards with 3oz/4oz copper thickness, high-layer-count multi-layer boards and special high-frequency materials. It solves common defects such as uneven etching and incomplete circuit development in traditional processes.
Stable Impedance Control: Consistent etching speed and uniform solution concentration ensure unified line width and line thickness of batch products. It effectively controls PCB impedance deviation, providing reliable technical support for high-precision circuit boards used in communication, automotive and industrial fields.
Intelligent Constant Temperature & Liquid Circulation System: Equipped with intelligent constant temperature control, automatic liquid replenishment and filtration circulation functions. It keeps the etching solution concentration, temperature and spray pressure in a stable state for a long time, avoiding batch quality differences caused by solution attenuation and temperature fluctuation.
Energy-saving, Environmental & Low Maintenance: The fully closed vacuum structure reduces liquid volatilization and reagent consumption, lowering production costs. The anti-corrosion equipment body and precision filter device reduce impurity residue, decrease daily maintenance frequency, and support long-term uninterrupted mass production.
Technical Parameters
Processing Board Size: Supports standard large-format PCB panels (customizable)
Applicable Board Thickness: 0.05mm – 5.0mm
Applicable Copper Thickness: 0.5oz – 4oz heavy copper
Line Width Accuracy: ±0.02mm
Etching Uniformity: ≥98%
Applicable Processes: Inner layer etching, outer layer etching, fine circuit forming
Compatible Board Types: Multi-layer PCB, HDI high-density board, heavy copper PCB, ultra-thin core board, high-frequency PCB
Operation Mode: Intelligent automatic circulation, continuous batch production

