VCP machine

VCP Machine

VCP Vertical Continuous Plating Line_看图.png2_副本.jpg

VCP Machine

VCP Vertical Continuous Plating Machine — Uniform Copper Plating for High-Density PCBs

Product Overview

Our VCP (Vertical Continuous Plating) machine is a high-precision automatic copper plating system used in PCB manufacturing. Boards are processed vertically and transported continuously through the plating line, which achieves highly uniform copper deposition on the surface and inside the drilled holes of the board. By combining vertical board travel, precise current control, uniform solution flow and automatic additive dosing, the equipment greatly improves copper thickness uniformity across the whole board and inside micro-vias. It effectively solves the common problems of uneven plating, thin hole wall, and poor filling in traditional horizontal plating lines, and is widely applicable to the copper plating of HDI boards, high-layer-count multilayer boards, thick copper boards and fine-line precision boards.

Core Advantages

Excellent Whole-Board Plating Uniformity: Vertical board orientation and optimized cathode / anode arrangement ensure highly uniform copper thickness from edge to center and between both sides of the board, effectively reducing plating thickness deviation and improving product consistency.
Superior Hole Filling & Via Metallization: Advanced solution flow and current control ensure reliable copper deposition inside micro-vias and blind holes, achieving good hole wall thickness and filling performance. It meets the strict via reliability requirements of HDI boards.
High Efficiency & High Throughput: Continuous vertical conveying and automated process control enable fast and stable plating. The machine supports large board sizes and high production throughput, greatly improving plating efficiency while reducing operating cost.
High-Precision Automatic Control: Equipped with precise rectifiers, automatic additive analysis and closed-loop process control, the equipment maintains stable plating parameters and consistent quality between batches, reducing defects and rework.
Excellent Material Compatibility: Applicable to FR4, high-frequency materials, high-Tg boards, thick copper and thin cores, providing flexible plating solutions for various board types and production requirements.
Intelligent Data Recording & Traceability: The system automatically records plating parameters, thickness data and quality information, realizing full-process traceability and helping the production team optimize plating processes and continuously improve quality stability.

Technical Parameters

Equipment Type: VCP Vertical Continuous Plating Machine
Plating Type: Through-hole plating, blind via plating and surface copper deposition
Copper Thickness Uniformity: High whole-board uniformity with closed-loop control
Applicable Board Thickness: Suitable for thin cores, thick copper and multilayer stack-ups
Maximum Panel Size: Up to 24" × 24" (610mm × 610mm)
Compatible Board Types: HDI high-density board, high-layer-count multilayer PCB, thick copper PCB, high-frequency board, high-Tg board
Working Mode: Fully automatic vertical conveying, plating, rinsing and drying
Data Function: Automatic parameter recording, additive analysis and full quality traceability

Company Equipment Strength

To build a rigorous and precise copper plating production system, our company is equipped with a complete set of advanced VCP vertical continuous plating machines, forming a full-coverage plating capability for through-hole, blind via and surface copper deposition. All plating machines adopt industry-leading vertical continuous plating technology with stable operation and long-term consistent plating performance. We support 24-hour uninterrupted batch production, which fully meets the strict copper plating quality requirements of high-end products. Through precise plating of every board and micro-via, we effectively control copper thickness uniformity and improve the final finished product yield. Perfect matching with front-end drilling, imaging, etching and subsequent processes ensures that every batch of PCB products delivered to customers meets high-standard quality requirements, highlighting our strict quality control system and strong comprehensive production strength.

Application Scope

The VCP vertical continuous plating machine is widely used in the copper plating of high-end HDI and multilayer PCBs. It is essential quality guarantee equipment for smartphones, 5G communication equipment, server hardware, automotive electronics, industrial control equipment, medical electronics and smart wearable product circuit boards. It provides reliable copper plating support for high-density, high-precision and high-reliability PCB products, ensuring stable and consistent product quality for global customers.