In recent years, our company has closely followed the industry trends toward high precision, intelligent manufacturing and green production, and has continuously increased R&D investment in production processes. A number of technological breakthroughs and innovative applications have been achieved in core manufacturing processes, comprehensively improving product quality, production efficiency and delivery capability, providing solid technical support for high-end market demands.
In terms of precision circuit processing, the company has optimized and improved the mSAP (Modified Semi-Additive Process) to realize stable mass production of high-layer HDI boards, with steadily improved accuracy of line width and spacing. It effectively meets the fine circuit requirements of 1.6T optical modules, intelligent hardware and other products. Meanwhile, LDI (Laser Direct Imaging) technology has been introduced to replace traditional exposure processes, enhancing the accuracy and consistency of pattern transfer, reducing manual errors, and ensuring the stability of high-frequency and high-speed signal transmission.
For microvia and multilayer PCB manufacturing, the company applies laser micromachining technology to improve the accuracy and aspect ratio of microvia processing. Combined with optimized multilayer lamination and low-stress drilling technologies, it ensures high interlayer alignment accuracy and structural reliability of high-layer PCBs, better adapting to the needs of AI servers, communication equipment and other fields.
In the electroplating process, the company adopts Vertical Continuous Plating (VCP) and blind via filling technology to improve plating uniformity and filling yield, solving the challenges of high-aspect-ratio via electroplating, and significantly enhancing product reliability and yield rate.
At the same time, the company vigorously promotes intelligent and green manufacturing. The AI intelligent quality inspection system has been launched to realize AOI and X-Ray intelligent detection, greatly improving defect detection rate, effectively reducing false rejects and enhancing quality control efficiency.
Green processes such as waste liquid recycling, water and electricity conservation, and halogen-free environmentally friendly materials are implemented in production, reducing energy consumption and emissions while meeting domestic and international environmental compliance requirements, enabling efficient production and sustainable development.
In the future, our company will continue to focus on process innovation, continuously optimize manufacturing capabilities, and provide customers with highly reliable PCB solutions with more advanced technologies, more stable quality and more efficient delivery, supporting the high-end upgrading of the industry.