2L Immersion Tin Aluminum Base PCB

Product Description:

The‍‌‍‍‌‍‌‍‍‌ 2L Immersion Tin Aluminum Base PCB, is a two-layer printed circuit board that pairs a standard FR4 core with an aluminum stiffener (thermal conductivity 3.0W/m·K). The surface finish is immersion tin which allows for great flatness and solderability. The total board thickness is 1.6mm, with the copper thickness after finishing being 2.5oz (87.5um) for high current carrying capacity. The solder mask color is matte green. This hybrid structure provides excellent mechanical support and heat dissipation, making it perfect for high-power LED modules, automotive headlamps, and motor drive ‍‌‍‍‌‍‌‍‍‌circuits.

Product Specifications:

Product Advantages:

Company Profile:

Founded in 1997, Multech PCB is a leading manufacturer of high-end printed circuit boards in China with nearly 30 years of industry experience. Founded by senior PCB experts, the company's headquarter is located in Qianhai, Shenzhen, with its factory is located in Huizhou. It covers a workshop area of over 20,000 square meters and is equipped with multiple modern automated production lines, with an annual output exceeding 2 million square meters, capable of efficiently handling prototype, medium and high volume orders.

Boasting a professional R&D team of more than 60 members, the company focuses on technological innovation, specializing in high-density multilayer boards, HDI, backplane PCBs, high-frequency boards, metal core PCBs, flexible and rigid-flex PCBs and other special PCBs. 80% of its products are exported to Europe, the United States, Japan and the Asia-Pacific region, widely used in high-tech industries such as telecommunications, industrial control, medical treatment, automotive and aerospace.

The company has passed international authoritative certifications including ISO9001, ISO14001, UL, RoHS and IATF16949, with fully compliant production processes and 100% full inspection before shipment to ensure stable and reliable quality. It has long provided one-stop PCB+PCBA solutions for global well-known enterprises, winning the trust of customers at home and abroad with high quality, cost-effectiveness and prompt delivery.

ISO 13485

ISO 9001

IATF 16949

ISO 14001

Manufacturing Process:

Product Quality Testing

· Incoming material – Aluminum thermal conductivity (3.0W/m·K confirmed), FR4 Tg, dielectric layer adhesion.

· Copper thickness – Cross-section microanalysis (2.5oz ±10%).

· Immersion tin thickness – XRF measurement, ≥1.0μm (typically 1.0–1.5μm).

· Thermal shock test – -40°C ↔ +125°C, 200 cycles, no delamination between FR4 and aluminum.

· Peel strength – ≥1.0 N/mm for dielectric layer on aluminum.

· Solderability – Wetting balance per IPC-J-STD-003.

· Electrical testing – 100% flying probe for continuity and isolation.

· Solder mask adhesion – Cross-hatch tape test after reflow simulation.

Quality Control

· Certifications: ISO9001, IATF16949, UL (file number available upon request).

· Process controls: SPC for etching, lamination (FR4 to aluminum), and immersion tin.

· Traceability: Unique lot number for each raw material (aluminum sheet, FR4, tin chemicals).

· Final inspection: 100% visual under magnification + AOI for matte green solder mask defects.

· Reliability lab: In-house thermal cycling, humidity (85°C/85%RH), and insulation resistance tests.

Pre-sale and After-sale Service

· Pre-sale

  · Free DFM review for FR4+aluminum hybrid design.

  · Thermal simulation assistance (3.0W/m·K aluminum base).

  · Rapid prototyping (sample within 5 working days).

· After-sale

  · 12-month warranty against material or workmanship defects.

  · 24-hour technical support for any quality issue.

  · Full traceability report and test data with each shipment.

FAQ:

Q1: What is the exact thermal conductivity of your aluminum base?

A: We guarantee 3.0W/m·K ±5% measured by laser flash method.

Q2: Can the immersion tin finish withstand multiple reflow cycles?

A: Yes, our immersion tin (≥1.0um) supports up to 3 lead-free reflow cycles without whiskering issues, thanks to an anti-tarnish additive.

Q3: Why is 2.5oz finished copper thickness needed?

A: For high-current traces (e.g., 10-15A constant) with minimal voltage drop and temperature rise.

Q4: Is the FR4 layer bonded directly to aluminum?

A: A thermally conductive dielectric layer (typically 50–100um) is laminated between FR4 and aluminum for electrical isolation and heat transfer.

Q5: What is the shelf life for immersion tin finish?

A: 6 months in vacuum-sealed packaging with moisture barrier; store below 25°C / <60% RH.

Q6: Can you provide UL certification for this hybrid board?

A: Yes, we can provide UL recognized component file for FR4+aluminum construction.

Q7: Is matte green solder mask available in other colors?

A: Matte green is standard; matte black, white, and red are available upon request (min. order may apply).